Semiconductor
For Wafer Edge Grinding, the edges of the raw wafer are ground to the desired profile. ... All equipment is extremely precise and has machines which work at high-speed – from Wafer Edge Grinders to CMPs, Wafer Probers and Polish Grinders right up to Wafer Dicing. Also with a Pick and Place System for high volume production, if desired.
WhatsApp: +86 18221755073